Provides DC components and conductor components characteristic measurement, EFA Electrical Failure Analysis, and can measure the resistance difference between each functional pin of the sample. The number of pins can reach up to 1024 Pins.

1. Supports multiple packaging forms of Sockets;

2. Quickly compare the potential of abnormal pin positions;

3. Multiple measurement modes can be selected from (EX: Pin-all, pin-pin);

4. Automatic comparison of results.

It provides the best chip Decap and compound Removal methods for various packaging components.

1. Decap LED, gallium arsenide chip, automotive chip, optically coupled chip.

2. Special Decap Backside, MEMS, packaging material production, various packaging disassembly.

3. Chemical etching analysis crater experiments, solder oil/stain removal, chemical etching removal to resist, Pin pin cleaning.